本溪M6000 Integrated Ball-and-Wedge Multi-Function Bonding Machine

The M6000 Ball-and-Wedge Integrated Multi-Function Bonding Machine is a manual bonding device used for electrical interconnection between chips and substrates as well as for information exchange among chips. Based on the ultrasonic bonding principle, this equipment achieves tight bonding between bond wires and substrate pads through a precision mechanical structure and highly integrated hardware–software control. It offers both ball bonding and wedge bonding functions and can handle a wide range of bond wire types, including gold wire, platinum wire, copper wire, silver wire, aluminum wire, and gold ribbon. It is widely applicable to laboratory R&D, prototype production, product evaluation, and product rework in the semiconductor industry.

Category:

本溪Multi-functional Bonder

86 400-673-6773

Product Description

Product Features

• The M6000 ball-and-wedge integrated multi-functional wire bonder is a manual bonding device used for electrical interconnection between chips and substrates, as well as for inter-chip data communication.

• This equipment is based on the ultrasonic bonding principle and, through a precision mechanical structure and highly integrated hardware–software control, achieves tight interconnection between lead wires and substrate pads. The equipment supports both ball bonding and wedge bonding functions.

• Bonding can be performed on various types of lead wires, including gold wire, platinum wire, copper wire, silver wire, aluminum wire, and gold ribbon;

• Widely applicable to laboratory R&D, pilot production of product prototypes, product evaluation, and product repair for semiconductor devices.

Clamping table


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