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Integrated Sensing and Computing Chip CZ-CSC-001

The Integrated Sensing and Computing Chip CZ-CSC-001 adopts a multi-chip stacked design architecture, based on advanced technologies such as FPGA, high-performance MCU, wideband RF transceivers, and more for multi-core, multi-die collaborative design.

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Low-Cost, Low-Power CZ-CSC-002 Chip

The Integrated Sensing and Computing Chip CZ-CSC-002 adopts a multi-chip stacked design architecture, based on advanced technologies such as FPGA, high-performance MCU, 30MHz-6GHz RF transceivers, and more for multi-core, multi-die collaborative design.

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Dual-Channel Ultra-Wideband High-Speed Transceiver Board

The dual-channel ultra-wideband high-speed transceiver board adopts a motherboard and daughterboard architecture.

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Unmanned System Communication Module

An autonomous communication chip integrated with reconfigurable baseband signal processing cores, wideband adaptable RF transceiver cores, and high-performance computing processing cores; a software environment for waveform and protocol development.

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DB300 Full-Function Desktop Automatic Die Bonding Machine

The DB300 full-function desktop automatic solidification machine is a high-precision micro-assembly system, specifically designed for compact spaces and high-precision bonding processes. featuring a laser vision-based system and force-controlled mounting, this machine ensures accurate component placement with ±10μm placement accuracy and 3μm laser height detection. Ideal for applications such as MEMS, CCD/CMOS, and infrared detectors, it offers high throughput, reaching 180 components per hour. Its non-destructive soft landing system minimizes damage, making it a versatile and efficient solution for your bonding needs.

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JD-0200 Laser Vision Lid Opener

The HORETECH series laser vision lid opener is capable of automatically, quickly, and accurately opening the lids of hermetically sealed post-packaged workpieces based on manually programmed paths. it can also perform secondary and multiple packaging. the equipment is user-friendly and highly reliable. its lid opening process is non-destructive, making it suitable for re-sealing after repairs, hence it is also referred to as a metal cap opener or non-destructive repair cap opener.

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MUX400 High Vacuum Soldering Furnace

The MUX400 high vacuum soldering furnace is built for high-precision applications such as IGBT modules, MCMs, hybrid circuits, sensor packaging, and eutectic bump soldering. with customizable design options, it adapts to your specific needs, including varying sizes and heights. the furnace is equipped with a PID control system, high vacuum technology, and high heating rates, ensuring uniform soldering conditions. Its fully automated operation, alongside gas support systems and advanced control features, delivers an optimal soldering environment.

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MUX200 High Vacuum Soldering Furnace

The MUX200 high vacuum soldering furnace offers a reliable solution for IGBT modules, TR components, MEMS, and optoelectronic device packaging. featuring advanced PID temperature control, high vacuum systems, and automated operation, it ensures consistent and precise soldering conditions. the system supports a wide range of gases and provides customizable tooling fixtures for stable soldering. Its efficient design and offline operation capabilities make it a dependable choice for high-performance soldering applications.

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