Home page

Products

Tel: +86-10-80842121

Tel: +86-13273253358

E-mail:lydiama@horetech.cn

Office location: A8, qingchuangyuan, yuehua street, fangshan district, Beijing

Production base: B2 satellite navigation industrial park, Gu'an county, Langfang city, Hebei province

JD-0200 Laser Vision Lid Opener

The HORETECH series laser vision lid opener is capable of automatically, quickly, and accurately opening the lids of hermetically sealed post-packaged workpieces based on manually programmed paths. it can also perform secondary and multiple packaging. the equipment is user-friendly and highly reliable. its lid opening process is non-destructive, making it suitable for re-sealing after repairs, hence it is also referred to as a metal cap opener or non-destructive repair cap opener.

Key words:

JD-0200

Classification:

Laser Vision Lid Opener

Product Consulting:

+86-10-80842121

lydiama@horetech.cn

Product inquiry

Product Overview

The HORETECH series laser vision lid opener is capable of automatically, quickly, and accurately opening the lids of hermetically sealed post-packaged workpieces based on manually programmed paths. It can also perform secondary and multiple packaging. the equipment is user-friendly and highly reliable. Its lid opening process is non-destructive, making it suitable for re-sealing after repairs, hence it is also referred to as a metal cap opener or non-destructive repair cap opener.

Application Devices

Used for FPGA, GPU, CPU, flip-chip bonding, hermetic ceramic packaging, hermetic metal packaging of rectangular, round, and polygonal optoelectronic devices, thick-film circuits, optical communication devices, quartz crystal oscillators, and destructive lid opening testing. It is also commonly used for precise opening and sealing in various packaging forms such as parallel sealing, laser sealing, and energy storage welding.

Special Note: This equipment plays an irreplaceable auxiliary role in DPA lid opening. Traditional DPA grinding to remove the carrier board involves significant risks.

The device uses micron-level laser detection assists with micron-level spindle runout, reducing grinding time by a factor of 50. It also controls the thickness of the wafer’s bottom adhesive to ensure that the wafer is not damaged, making it easier for the subsequent chemical removal of the bottom adhesive.

Working Principle

The machine utilizes auxiliary vision paired with laser AI for height and horizontal calibration. this ensures that material-related errors do not affect the cutting process, ensuring 100% reusability of the lid after opening. the camera recognizes dimensions and feeds back the program, after which the laser positioning is corrected. throughout the operation, the system tracks and adjusts accordingly.

Key Features

1. Mmilling along the contour line

2. Direct origin setting with reset function

3. Software virtual machining allows previewing of machining paths.

Technical Specifications

Table Travel	205 mm × 245 mm
Maximum cap Opening Size	150 mm × 200 mm
Total Power Consumption	1.5 KW
Weight	90 kg
Dimensions	(L) 800 mm × (W) 700 mm × (H) 900 mm