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Tech Nexus
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Industry Solutions
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Desktop Automatic Die Bonder DB300
The laser-vision-based micro-assembly die-bonding system effectively addresses users’ requirements for compact footprint and high-precision processing, featuring a modular design with flexible configuration and easy operation. Its core module integrates two key subsystems: a high-precision force-controlled placement system and a dispensing-and-fixing system. The system employs a micrometer-level gantry structure with single- or dual-drive configurations, enabling convenient integration and customization with other modules.
Ten Years of Dedication, Multiple Patents
R&D team: 15 years of technological expertise in semiconductor packaging
Patent conversion: 20+ patents applied across 8 major Industries
Worldwide Service
Domestic: Serving 300+ leading optoelectronics/new energy vehicle enterprises
International: Products covering 15 countries, Including Russia, Iran, India, and Pakistan
Trade: Global delivery system with CE/ISO certification
HUATAO GROUP
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Our staff will contact you within 24 hours (working days), if you need other services,Welcome to call service hotline:+86-10-80842121
