Desktop Automatic Die Bonder DB300

The laser-vision-based micro-assembly die-bonding system effectively addresses users’ requirements for compact footprint and high-precision processing, featuring a modular design with flexible configuration and easy operation. Its core module integrates two key subsystems: a high-precision force-controlled placement system and a dispensing-and-fixing system. The system employs a micrometer-level gantry structure with single- or dual-drive configurations, enabling convenient integration and customization with other modules.
< 1 >

Get free product quotes

Our staff will contact you within 24 hours (working days), if you need other services,Welcome to call service hotline:+86-10-80842121