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Tel: +86-13273253358

E-mail:lydiama@horetech.cn

Office location: A8, qingchuangyuan, yuehua street, fangshan district, Beijing

Production base: B2 satellite navigation industrial park, Gu'an county, Langfang city, Hebei province

Desktop Automatic Die Bonder DB300

The laser-vision-based micro-assembly die-bonding system effectively addresses users’ requirements for compact footprint and high-precision processing, featuring a modular design with flexible configuration and easy operation. Its core module integrates two key subsystems: a high-precision force-controlled placement system and a dispensing-and-fixing system. The system employs a micrometer-level gantry structure with single- or dual-drive configurations, enabling convenient integration and customization with other modules.

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Desktop Automatic Die Bonder

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1. Application Overview:

2. Equipment Features

*The chip-mounting dispensing platform is equipped with an AI-based planar alignment system, which significantly reduces voids in the die-attach adhesive at the bottom of the die.

*Soft-landing force-control system: gentle contact forces prevent damage to chips or leave no marks on their surfaces, perfectly addressing the limitations of conventional pneumatic cylinder motion control and boosting production capacity.

*Customizable with optional curing module, wafer handling module, automatic nozzle-change module, and automatic needle-nozzle adjustment module, as required by the specific product.

*Can simultaneously meet the requirements of high-precision experimental chip mounting and small-batch production.

3. Equipment Parameters

Project	Parameters
Equipment dimensions	800mm × 700 mm × 650 mm
XYZ axis travel	300mm300mm50mm
Mounting device size	0.15–25 mm
Workwear Scope	180*180mm
XY drive configuration	Servo
Maximum travel speed of the X and Y axes	XYZ=50mm/s
Limit function	Electronic soft limit + physical limit
Laser height measurement	3 micrometers
Precision of the needle-tip correction module	3 microns
Platform Structure	Dual-Y Optical Platform
Overall mounting accuracy	±10 μm
Adhesion Control	10g-80g
Chip orientation	Different heights, different angles
Nozzle	Bakelite nozzle/rubber nozzle
Patch pressure	0.01N–0.1N (10 g–100 g)
Production Efficiency	No less than 180 components per hour (based on a chip size of 0.5 mm × 0.5 mm).
Minimum droplet diameter	0.2 mm (using a 0.1 mm aperture needle)
Dispensing Mode	Pressure Time Mode (Standard Machine)
High-precision dispensing pump and control valve with automatic positive/negative pressure adjustment for dispensing	Perform differential feedback along the path.
Dispensing Air Pressure Setting Range	0.01–0.5 MPa
Device Products	Wafer, MEMS, infrared detector, CCD/CMOS, flip chip
Process	Epoxy resin, silver paddle, thermal conductive adhesive, etc.
Weight	Approximately 120 kg
Input Power	220 AC ±5% @ 50 Hz, 10 A
Air (nitrogen)	0.2 MPa ~ 0.8 MPa