scroll down

Who We Are

Specializing in semiconductor micro-packaging and processing services

Read more +

Huaao Fuxing

Advantage

Horetech-Corporate Advantages

 

Precision Micro-Packaging, Full-Industry Chain Intelligent Manufacturing

Covering the complete process of "precision bonding → intelligent die attach → vacuum packaging → laser lid opening"

Providing closed-loop services of "equipment R&D → process optimization → production line design → finished product processing"

 

Dual-Core Drive, Four-Domain Radiation

R&D hubs: Beijing fangshan R&D center + shenzhen innovation R&D center

Manufacturing base: Hebei gu'an aerospace industrial park

Service network: Four key service hubs in chengdu, zhangjiagang, beijing, and shenzhen

20 +term

"Over 20 patent applications"

400

"Cleanroom"

180 tower

"Annual production of vacuum furnace products"

160 tower

"Annual production of parallel sealing products"

Learn more

Strong Corporate Strength

Strong Corporate Strength

Specialization and innovation, benchmark in smart manufacturing
national patent-intensive high-tech enterprise

Professional R&D Team

Professional R&D Team

More than 15 years of technological expertise in semiconductor packaging
20+ patents applied across 8 major industries

Global Sales Network

Global Sales Network

Domestic: Serving 300+ leading enterprises in optoelectronics and new energy vehicles
International: Products covering 15 countries, including russia, iran, india, and pakistan

Advanced Processing Services

Advanced Processing Services

Micro-assembly packaging solutions
Customized packaging processing
Mass production of Infrared detection components
Full process delivery of finished products

Our Solutions

Customer Solutions

Our Products

Featured Products

JD-0200 Laser Vision Cap-Opening Machine


Precision opening and sealing of rectangular, circular, polygonal, and irregular-shaped devices for ceramic and metal packaging.

MUX400 High-Vacuum Eutectic Furnace


Uncooled infrared detectors, lasers, LED eutectic bonding, RF and microwave technologies, and radar

MUX200 Vacuum Eutectic Soldering Furnace


Soldering of germanium windows for uncooled infrared detectors, lasers, LED eutectic bonding, RF and microwave applications, and radar

PAL-200 Semi-Automatic Parallel Sealing and Welding Machine


Parallel seal welding plays a crucial role in integrated circuit packaging, particularly in high-reliability hermetic packaging. It is well suited for ceramic packages and metal can packages that demand stringent control of moisture content and superior gas tightness. As a key piece of equipment, the parallel seal-welding machine is extensively used in the packaging processes of optoelectronic devices, hybrid integrated circuits, BOX components, and other similar products.

PAL-A200 Automatic Parallel Sealing and Welding Machine


The automatic alignment and parallel seam sealing welder is an automated piece of equipment. Operators manually place the tube shell and cover plate into their respective fixtures, select the corresponding process recipe, and initiate the program. The equipment then automatically picks up the cover plate, captures a visual image, and, following computational processing, precisely positions the cover plate on the tube shell to achieve accurate alignment before performing spot welding and seam welding. This equipment is capable of hermetically sealing joints between metal components, metallized ceramic substrates, and metal cover plates. It is equipped with a highly reliable PLC, an industrial PC, and an advanced high-frequency inverter welding power supply, delivering fast dynamic response and high control accuracy. The inclusion of an automated cover-plate pick-up mechanism and a vision system ensures that the equipment can meet the demands of high-precision, fully automated cover-plate alignment. In addition, an atmosphere-controlled glove box provides an optimal working environment for the welding process.

Learn more

Worldwide Service

Global Collaboration, Win-Win Cooperation

Domestic: Serving 300+ leading optoelectronics/new energy vehicle enterprises

International: Products covering 15 countries, including russia, iran, india, and pakistan

Trade: Global delivery system with Ce/fcc certification

 

Philosophy

Innovation-driven craftsmanship, integrity-bound commitment

 

Value Proposition

Making every bonding a value fulcrum

Click to join

News Center

"Follow Horetech's updates"

2025-03-31

Application of the MUX400 high-vacuum soldering furnace and JD-200 laser vision lid opener in thermoelectric cooler manufacturing for the photonics and optoelectronics industry

Thermoelectric coolers (TECs) are core thermal management components in the fields of photonics and optoelectronics, with their manufacturing processes placing strict demands on vacuum soldering precision, packaging hermeticity, and non-destructive testing. For example, a global leader in optoelectronic devices faces stringent process requirements in the research, development, and application of thermoelectric coolers. their products must meet high thermal conductivity and low solder void rate (<10%) to improve the efficiency and reliability of the TECs, while also adapting to the miniaturization and high-power density trends in the industry.

2025-03-31

Deep application of the MUX300 thermally activated high vacuum soldering furnace and JD-0200 laser vision lid opener in sensor manufacturing

The high-reliability packaging of integrated circuits (ICs) and power devices is a critical aspect that ensures the long-term stability of products, particularly in high-reliability applications such as analog chips and power MOSFETs. these applications require both hermetic sealing

2025-03-31

Collaborative application of the PAL-A200 automatic parallel sealing machine and M6000 multifunctional ball-wedge integrated bonder in integrated circuit and power device manufacturing

The high-reliability packaging of integrated circuits (ICs) and power devices is a critical aspect that ensures the long-term stability of products, particularly in high-reliability applications such as analog chips and power MOSFETs. these applications require both hermetic sealing

2025-01-03

Demystifying the maintenance skills of getter vacuum welding furnace

In modern industry, getter vacuum welding furnaces play an extremely important role. whether in aerospace, automotive manufacturing or the production of electronic products, this equipment can provide high-quality welding results. But, did you know? without proper maintenance, the performance of getter vacuum welding furnaces can be greatly compromised. Today, let's talk about how to effectively maintain this equipment to ensure that it is always in top condition.

Get free product quotes

Our staff will contact you within 24 hours (working days), if you need other services,Welcome to call service hotline:+86-10-80842121