HORETECH
Pioneering precision in semiconductor packaging & advanced welding solutions

-Committed to customer-centric excellence through relentless R&D and innovative process engineering.
-Providing integrated equipment and process technologies to tackle your manufacturing challenges.
-A one-stop platform for R&D, production, and sales, powered by professional teams for cost-effective solutions.

MORE
HORETECH
MUX300: thermally activated high vacuum soldering furnace

-Precise activation & sealing: Perfect for infrared detectors, MEMS, gyroscopes and high-precision applications with getters.
-High-temperature control: PID control ensures uniform heating and fast cooling.
-Stable vacuum environment: High-vacuum technology ideal for soldering and activating sensitive components.

MORE
HORETECH
PAL-A200: Automatic parallel sealing machine

-Automated alignment & inspection: Ensures accurate sealing by auto-aligning and inspecting cover plates.
-Adjustable welding program: Flexible settings for precise welding across various components.
-Accurate Z-Axis control: Delivers consistent spot and seam welding for electronic packaging.

MORE
scroll down

Who We Are

Specializing in semiconductor micro-packaging and processing services

Read more +

Huaao Fuxing

Advantage

Horetech-Corporate Advantages

 

Precision Micro-Packaging, Full-Industry Chain Intelligent Manufacturing

Covering the complete process of "precision bonding → intelligent die attach → vacuum packaging → laser lid opening"

Providing closed-loop services of "equipment R&D → process optimization → production line design → finished product processing"

 

Dual-Core Drive, Four-Domain Radiation

R&D hubs: Beijing fangshan R&D center + shenzhen innovation R&D center

Manufacturing base: Hebei gu'an aerospace industrial park

Service network: Four key service hubs in chengdu, zhangjiagang, beijing, and shenzhen

20 +term

"Over 20 patent applications"

400

"Cleanroom"

180 tower

"Annual production of vacuum furnace products"

160 tower

"Annual production of parallel sealing products"

Learn more

Strong Corporate Strength

Strong Corporate Strength

Specialization and innovation, benchmark in smart manufacturing
national patent-intensive high-tech enterprise

Professional R&D Team

Professional R&D Team

More than 15 years of technological expertise in semiconductor packaging
20+ patents applied across 8 major industries

Global Sales Network

Global Sales Network

Domestic: Serving 300+ leading enterprises in optoelectronics and new energy vehicles
International: Products covering 15 countries, including russia, iran, india, and pakistan

Advanced Processing Services

Advanced Processing Services

Micro-assembly packaging solutions
Customized packaging processing
Mass production of Infrared detection components
Full process delivery of finished products

Our Solutions

Customer Solutions

Our Products

Featured Products

DB300 Full-Function Desktop Automatic Die Bonding Machine


The DB300 full-function desktop automatic solidification machine is a high-precision micro-assembly system, specifically designed for compact spaces and high-precision bonding processes. featuring a laser vision-based system and force-controlled mounting, this machine ensures accurate component placement with ±10μm placement accuracy and 3μm laser height detection. Ideal for applications such as MEMS, CCD/CMOS, and infrared detectors, it offers high throughput, reaching 180 components per hour. Its non-destructive soft landing system minimizes damage, making it a versatile and efficient solution for your bonding needs.

JD-0200 Laser Vision Lid Opener


The HORETECH series laser vision lid opener is capable of automatically, quickly, and accurately opening the lids of hermetically sealed post-packaged workpieces based on manually programmed paths. it can also perform secondary and multiple packaging. the equipment is user-friendly and highly reliable. its lid opening process is non-destructive, making it suitable for re-sealing after repairs, hence it is also referred to as a metal cap opener or non-destructive repair cap opener.

MUX400 High Vacuum Soldering Furnace


The MUX400 high vacuum soldering furnace is built for high-precision applications such as IGBT modules, MCMs, hybrid circuits, sensor packaging, and eutectic bump soldering. with customizable design options, it adapts to your specific needs, including varying sizes and heights. the furnace is equipped with a PID control system, high vacuum technology, and high heating rates, ensuring uniform soldering conditions. Its fully automated operation, alongside gas support systems and advanced control features, delivers an optimal soldering environment.

MUX200 High Vacuum Soldering Furnace


The MUX200 high vacuum soldering furnace offers a reliable solution for IGBT modules, TR components, MEMS, and optoelectronic device packaging. featuring advanced PID temperature control, high vacuum systems, and automated operation, it ensures consistent and precise soldering conditions. the system supports a wide range of gases and provides customizable tooling fixtures for stable soldering. Its efficient design and offline operation capabilities make it a dependable choice for high-performance soldering applications.

MUX300 Thermally Activated High Vacuum Soldering Furnace


The MUX300 thermally activated high vacuum soldering furnace is designed for the precise activation and sealing of getter-based products, ideal for uncooled infrared detectors, MEMS, gyroscopes, and other high-precision applications. equipped with advanced temperature control, high vacuum systems, and customizable tooling fixtures, this furnace ensures uniform heating, rapid cooling, and reliable soldering in a stable vacuum environment. Its high-temperature capabilities and PID temperature control guarantee exceptional performance for sensitive components, making it the perfect choice for your soldering and activation needs.

PAL-V200 Semi-Automatic Vacuum Parallel Sealing Machine


The PAL-V200 semi-automatic vacuum parallel sealing machine is designed for high and low vacuum sealing of ceramic substrates and metal lids. it features precise alignment, adjustable welding pressure, and a powerful vacuum system that ensures long-lasting, high-quality seals. the machine also offers an optional electrical activation module for products with getters. ideal for sealing in high/low vacuum environments, it guarantees precision and efficiency for both small and large components.

Learn more

Worldwide Service

Global Collaboration, Win-Win Cooperation

Domestic: Serving 300+ leading optoelectronics/new energy vehicle enterprises

International: Products covering 15 countries, including russia, iran, india, and pakistan

Trade: Global delivery system with Ce/fcc certification

 

Philosophy

Innovation-driven craftsmanship, integrity-bound commitment

 

Value Proposition

Making every bonding a value fulcrum

Click to join

News Center

"Follow Horetech's updates"

2025-03-31

Application of the MUX400 high-vacuum soldering furnace and JD-200 laser vision lid opener in thermoelectric cooler manufacturing for the photonics and optoelectronics industry

Thermoelectric coolers (TECs) are core thermal management components in the fields of photonics and optoelectronics, with their manufacturing processes placing strict demands on vacuum soldering precision, packaging hermeticity, and non-destructive testing. For example, a global leader in optoelectronic devices faces stringent process requirements in the research, development, and application of thermoelectric coolers. their products must meet high thermal conductivity and low solder void rate (<10%) to improve the efficiency and reliability of the TECs, while also adapting to the miniaturization and high-power density trends in the industry.

2025-03-31

Deep application of the MUX300 thermally activated high vacuum soldering furnace and JD-0200 laser vision lid opener in sensor manufacturing

The high-reliability packaging of integrated circuits (ICs) and power devices is a critical aspect that ensures the long-term stability of products, particularly in high-reliability applications such as analog chips and power MOSFETs. these applications require both hermetic sealing

2025-03-31

Collaborative application of the PAL-A200 automatic parallel sealing machine and M6000 multifunctional ball-wedge integrated bonder in integrated circuit and power device manufacturing

The high-reliability packaging of integrated circuits (ICs) and power devices is a critical aspect that ensures the long-term stability of products, particularly in high-reliability applications such as analog chips and power MOSFETs. these applications require both hermetic sealing

2025-01-03

Demystifying the maintenance skills of getter vacuum welding furnace

In modern industry, getter vacuum welding furnaces play an extremely important role. whether in aerospace, automotive manufacturing or the production of electronic products, this equipment can provide high-quality welding results. But, did you know? without proper maintenance, the performance of getter vacuum welding furnaces can be greatly compromised. Today, let's talk about how to effectively maintain this equipment to ensure that it is always in top condition.

Get free product quotes

Our staff will contact you within 24 hours (working days), if you need other services,Welcome to call service hotline:+86-10-80842121