MUX300: Achieves desiccant activation and soldering in a 10⁻⁵Pa vacuum environment with ±1℃ temperature control accuracy, ensuring stable desiccant activation and precise melting and sealing of solder at high temperatures, meeting aerospace-grade leak rate requirements.
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Tech Nexus
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Industry Solutions
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Deep application of the MUX300 thermally activated high vacuum soldering furnace and JD-0200 laser vision lid opener in sensor manufacturing
Release time:
2025-03-31
The high-reliability packaging of integrated circuits (ICs) and power devices is a critical aspect that ensures the long-term stability of products, particularly in high-reliability applications such as analog chips and power MOSFETs. these applications require both hermetic sealing
Solution overview
Sensors, as core components of precision electronic devices, have strict requirements for vacuum environment control, packaging accuracy, and non-destructive testing. for instance, a global leader in sensor manufacturing produces high-performance MEMS devices, uncooled infrared sensors, and aerospace-grade gyroscopes, all of which require activation of desiccants, alloy solder sealing, and non-destructive lid opening testing, as well as secondary rework under high vacuum conditions.
The combined solution of MUX300 and JD-0200 meets the following key advantages to address these requirements:
JD-0200: Employs AI vision positioning and laser ranging technology to achieve dust-free, non-destructive lid opening, supporting secondary packaging verification. the system uses micron-level laser detection, assisting with micrometer-level spindle wobble reduction, cutting polishing time by over 50 times, reducing rework costs, and improving R&D efficiency. this solution has passed international reliability certifications (such as IEC standards), ensuring the long-term stability of customer products in extreme environments.
Equipment functions and deep integration with sensor manufacturing
MUX300 thermally activated high vacuum soldering furnace：
1. Desiccant activation and packaging integration:
Complete desiccant activation and soldering simultaneously under high vacuum (10⁻⁵Pa) and precise temperature control (±1℃), eliminating contamination risks caused by process switching. especially suitable for protecting sensitive structures in MEMS devices.
Contact heating/cooling technology (rate: 120℃/min) combined with a uniform temperature heating plate design ensures temperature uniformity (±2.5℃), preventing thermal stress from damaging micro-mechanical structures.
2. Customized production and high yield assurance:
Modular tooling supports batch processing of sensors of various sizes, with a positioning accuracy of 0.02mm, adaptable to complex geometric device shapes.
Bellows-type sealing technology ensures zero leakage, meeting the stringent long-term vacuum stability requirements for aerospace-grade sensors.
3. Energy-saving and eco-friendly design:
A compact furnace body structure reduces vacuum extraction energy consumption, combined with a fast cooling system to shorten production cycles and reduce energy consumption, aligning with ESG goals.
JD-0200 laser vision lid opener：
1. Precision non-destructive lid opening technology:
Milling along the lid profile with CCD alignment (±5μm precision) ensures the integrity of sensitive components (e.g., MEMS electric field sensor chips), avoiding the risk of damage associated with traditional mechanical lid opening.
Built-in dust extraction system and real-time path monitoring prevent particle contamination, making it suitable for high-precision sensor rework in cleanroom environments.
2. Flexible rework and data verification:
Supports multiple lid opening and closing cycles, enabling failure analysis and accelerating R&D iteration.
Virtual machining path preview function optimizes lid opening strategies, reducing trial-and-error costs.
Typical sensor manufacturing scenarios and equipment synergy
MEMS sensor packaging | High-precision infrared detector production | Aerospace-grade gyroscope manufacturing |
| MUX300: Completes desiccant activation and sealing welding under vacuum, preventing structural failure due to moisture penetration, improving device lifespan. | Ensures detector hermeticity via alloy solder sealing, adapting to long-term use under extreme temperature conditions. | Compatible with high-temperature alloys for packaging at 450°C, meeting the 10⁻⁵Pa vacuum requirement, ensuring device reliability under vibration and temperature changes. |
| JD-0200: Non-destructive lid opening after packaging, analyzes micro-mechanical structure deformation, optimizes welding parameters, and improves yield by over 20%. | Lid opening for verifying optical components inside the detector, ensuring cleanliness of optical surfaces in a dust-free environment. | Regular inspection of packaging quality supports secondary sealing for long-cycle testing requirements for aerospace devices. |
Customer benefits and industry value
1. Breakthrough in technical barriers: by using vacuum sealing and non-destructive testing technology, the solution meets international leak rate standards (1×10⁻⁹Pa·m³/s), enhancing market competitiveness.
2. Cost optimization: reduces scrap rates caused by packaging damage, saves over 30% in material costs on secondary rework, and increases production efficiency with batch manufacturing.
3. Sustainable development: the dust-free process and low energy consumption design align with green manufacturing trends, helping customers achieve carbon-neutral goals.
Conclusion
The combination of the MUX300 and JD-0200 provides a comprehensive end-to-end solution for the sensor industry, covering MEMS, infrared detection, aerospace, and other high-value fields. through process optimization and technological innovation, this solution has helped global customers achieve product performance upgrades and production capacity expansion, becoming the benchmark choice for high-reliability sensor manufacturing.
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