Solution overview

The high-reliability packaging of integrated circuits (ICs) and power devices is a critical aspect that ensures the long-term stability of products, particularly in high-reliability applications such as analog chips and power MOSFETs. these applications require both hermetic sealing and precise bonding processes. taking an example of a leading domestic high-tech enterprise specializing in the design of silicon-based high-reliability analog ICs and power devices, the products include power management chips, precision operational amplifiers, and power devices. these products demand rigorous accuracy in packaging processes, hermetic sealing, and production efficiency.

The combination of the PAL-A200 automatic parallel sealing machine and the M6000 multifunctional ball-wedge integrated bonder meets the following collaborative advantages to address these requirements:

PAL-A200: Integrates high-precision visual alignment (≤0.02mm) and high-frequency inverter welding power, ensuring hermetic sealing of metal and ceramic shells (leak rate < 0.005vol%/h) and adapting to complex-shaped devices.

M6000: Supports multiple wire diameters for aluminum wire bonding (18–100μm) and ultrasonic force control technology, achieving high-precision weld point pressure (1–250g) to enhance the reliability of power device connections.

This solution helps customers achieve performance breakthroughs in industrial automation, sensors, and instrumentation fields.

Equipment functions and deep integration with customer needs

PAL-A200 automatic parallel sealing machine:

This machine uses an advanced visual alignment system, automatic cover plate pickup, and high-frequency inverter welding power supply to ensure optimal dynamic response and precise control. the required modification involves replacing the CCD wiring board with aviation plugs, further improving the system's stability in challenging manufacturing environments.

1. High-precision hermetic sealing

The visual alignment system (range 2–30mm), combined with the aviation plug upgrade (replacing the original CCD wiring board), enhances signal transmission stability and anti-interference capabilities. it adapts to high-frequency inverter power (4kHz), ensuring continuous welding trajectory and compliance with hermetic sealing standards.

The vacuum oven (limit vacuum ≤5Pa) and glove box (dew point ≤80℃) work in tandem to effectively remove moisture and oxygen from the shell, meeting high-reliability sealing requirements.

2. Automation and flexible production

Supports automatic packaging of rectangular, circular, and polygonal shells (corner radii R0.3–2mm), welding speeds of 0.1–50mm/s, and accommodates small-batch, multi-variety production needs.

The four-layer heating plate design (temperature uniformity ±5℃) optimizes thermal management, reducing thermal stress on sensitive chips.

M6000 multifunctional ball-wedge integrated bonder：

This machine supports both ball and wedge bonding processes. it uses platinum, gold, aluminum, copper, and silver wires, making it an indispensable tool in semiconductor backend packaging processes.

1. Multiple wire diameter compatibility and high-precision bonding

Supports 25–100μm aluminum wire bonding, combined with voice coil motor force control technology (precision 0.4mW), ensuring even welding point pressure and reducing the risk of cold solder joints. it adapts to high current handling requirements of power MOSFETs and operational amplifier chips.

the dual-mode switch between wedge and ball bonding accommodates different packaging scenarios (e.g., deep cavity bonding and high-density interconnection).

2. Intelligent operation and maintenance

The 7-inch touchscreen (with chinese and english interfaces) and FPGA parallel control algorithm simplify parameter settings and improve operational efficiency.

The electric braking system eliminates the need for compressed air, reducing energy consumption and maintenance costs, making it suitable for cleanroom environments.

High-precision ultrasonic control and force compensation algorithms ensure fast bonding speeds and precise pressure control.

Typical application scenarios and achievements

Customer benefits and industry value

1. Breakthrough in technical barriers: The hermetic sealing and multiple wire diameter bonding technology meet military-grade reliability requirements, assisting customers in obtaining certifications such as AECQ100.

2. Cost optimization: Automated processes reduce manual intervention, increase production efficiency by 30%, and reduce material waste by 20%.

3. Global adaptability: The equipment supports multi-language interfaces and international standards (e.g., RoHS), meeting European and American market requirements for green manufacturing.

4. R&D acceleration: Virtual machining parameter preview and real-time monitoring features shorten new product development cycles by 25%.

Conclusion

The combination of the PAL-A200 automatic parallel sealing machine and the M6000 multifunctional ball-wedge Integrated Bonder provides a comprehensive end-to-end solution for the integrated circuit and power device industries, covering high-reliability analog chips, power modules, and sensors. through technological innovation and process optimization, this solution has helped numerous global customers achieve capacity upgrades and market expansion, becoming the benchmark choice for high-value-added electronic manufacturing.