Industry Solutions-Horetech Renaissance Provide packaging and deep processing services

Application of the MUX400 high-vacuum soldering furnace and JD-200 laser vision lid opener in thermoelectric cooler manufacturing for the photonics and optoelectronics industry

Thermoelectric coolers (TECs) are core thermal management components in the fields of photonics and optoelectronics, with their manufacturing processes placing strict demands on vacuum soldering precision, packaging hermeticity, and non-destructive testing. For example, a global leader in optoelectronic devices faces stringent process requirements in the research, development, and application of thermoelectric coolers. their products must meet high thermal conductivity and low solder void rate (<10%) to improve the efficiency and reliability of the TECs, while also adapting to the miniaturization and high-power density trends in the industry.

Deep application of the MUX300 thermally activated high vacuum soldering furnace and JD-0200 laser vision lid opener in sensor manufacturing

The high-reliability packaging of integrated circuits (ICs) and power devices is a critical aspect that ensures the long-term stability of products, particularly in high-reliability applications such as analog chips and power MOSFETs. these applications require both hermetic sealing

Collaborative application of the PAL-A200 automatic parallel sealing machine and M6000 multifunctional ball-wedge integrated bonder in integrated circuit and power device manufacturing

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