Multi-functional Bonder-Product Center-Horetech Renaissance Provide packaging and deep processing services

Home page

Product Series

M6000 Multifunctional Ball-Wedge Integrated Bonder

The M6000 multifunctional ball-wedge integrated bonder is a high-precision bonding solution suitable for various wire diameters and materials, including gold, platinum, copper, and aluminum. with customizable bonding knife types, ultrasonic power control, and an adjustable worktable, this machine ensures precise bonding for a wide range of applications. Featuring a 15X magnification microscope and a versatile hot stage, the M6000 guarantees top-tier performance for advanced bonding needs in electronics and microelectronics.

View details +

Get quote +

M6100 Multifunctional Ball Bonder

The M6100 multifunctional ball bonder offers a comprehensive solution for wire bonding with precise control over bonding pressure, wire feed mechanism, and ultrasonic power. this machine supports multiple wire diameters and bonding knife types for diverse applications. with its adjustable worktable, high-precision control, and integrated microscope, the M6100 delivers exceptional performance for fine-wire bonding, ensuring superior results for electronic components in various industries.

View details +

Get quote +

M6200 Multifunctional Wedge Bonder

The M6200 multifunctional wedge bonder is designed for precise wedge bonding with customizable wire diameter ranges and bonding knife options. it features an adjustable bonding pressure system, ultrasonic power control, and a versatile wire feed mechanism for a range of bonding applications. with a 15X magnification microscope, temperature-controlled hot stage, and user-friendly touchscreen interface, the M6200 ensures precision and reliability for advanced bonding operations in electronics manufacturing.

View details +

Get quote +

< 1 >