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Tel: +86-10-80842121

Tel: +86-13273253358

E-mail:lydiama@horetech.cn

Office location: A8, qingchuangyuan, yuehua street, fangshan district, Beijing

Production base: B2 satellite navigation industrial park, Gu'an county, Langfang city, Hebei province

M6200 Multifunctional Wedge Bonder

The M6200 multifunctional wedge bonder is designed for precise wedge bonding with customizable wire diameter ranges and bonding knife options. it features an adjustable bonding pressure system, ultrasonic power control, and a versatile wire feed mechanism for a range of bonding applications. with a 15X magnification microscope, temperature-controlled hot stage, and user-friendly touchscreen interface, the M6200 ensures precision and reliability for advanced bonding operations in electronics manufacturing.

Key words:

M6200

Classification:

Multi-functional Bonder

Product Consulting:

+86-10-80842121

lydiama@horetech.cn

Product inquiry

Equipment Introduction

The M6200 multifunctional wedge bonder is a manual wedge bonding equipment used to connect the bonding pads on chips and lead frames using platinum wire, gold wire/strip, aluminum wire, silver wire, or copper wire. it is one of the key devices essential for the back-end packaging process in semiconductor production lines.

The M6200 bonding machine features an XYZ integrated operation handle and an electric brake system, offering flexibility and ease of operation. the unique ultrasonic control algorithm ensures stable ultrasonic frequency output and fast response time. the FPGA parallel control algorithm design allows for fast bonding speed. the high-precision voice coil motor force control technology, coupled with force compensation algorithms, ensures accurate bonding pressure control and high bonding precision. the integrated design of the entire machine ensures a compact structure and good user experience.

Main Performance Indicators

Item	Specification
Maximum Cavity Depth	21mm
Bonding Pressure	1-250g, with 1g increments; program-controlled, adjustable interface
Brake Type	Electric, no need for compressed air
Adjustable Workbench Height	20mm
Workbench Dimensions	270mm×265mm

Application Fields

The M6200 multifunctional wedge bonder is widely used in microwave devices, hybrid circuits, RF devices/modules, discrete components, sensors, COB modules, MCM, MEMS devices, optoelectronic devices, etc.

Standard Configuration

Name	Model
Main Unit	M6200 (Wedge Bonder)
Temperature Controller	220VAC 50/60Hz
Holding Platform	3″ with clips, non-slotted, 200℃
Microscope	15X magnification
Wire Spool	1/2″
Wire Clamp	90° wire feeding mechanism
Liftable Workbench	Travel 20mm
LED Ring Light	6W, brightness adjustable

Peripheral Parameters

Item	Specification
Input Voltage	220VAC±10%
Power Consumption	500W
Frequency	50Hz-60Hz
Dimensions	603mm(L)×596mm(W)×319mm(H)
Weight	46kg

Equipment Installation

Unpacking

The M6200 wire Bonder's packaging box uses a wooden base with pearl cotton lining for protection and a hard cardboard box for outer packaging. The box dimensions are 760mm(L)×760mm(W)×430mm(H) as shown in Figure 2.1.

Figure 2.1 M6200 Multifunctional Bonder External Packaging Box

After unpacking, check the layout inside the box (as shown in Figure 2.2) and compare the items with the packing list in Table 2.1 to ensure the model and quantity match and that no items are damaged. If any damage is found, please contact the manufacturer.

Table 2.1 M6200 Wedge Bonder Delivery List

No.	Name	Product Model	Quantity
1	Multifunctional Wedge Bonder Main Unit	M6200, Custom by Hanxian	1
2	Wire Clamp	90º Wire Feeding Mechanism, Custom by Hanxian	1
3	Liftable Workbench	Custom by Hanxian	1
4	Microscope Body	SZ51-60	1
5	Eyepiece	WHSZ15X-H	2