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M6200
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M6200 Multi-Function Wedge Bonding Machine
The M6200 multi-functional wire bonder is a manual wedge-bonding machine used to connect the bond pads on the die to the bond pads on the lead frame using platinum wire, gold wire or gold ribbon, aluminum wire, silver wire, or copper wire; it is one of the essential key pieces of equipment in the back-end packaging process on semiconductor production lines.
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