Home page

Products

Tel: +86-10-80842121

Tel: +86-13273253358

E-mail:lydiama@horetech.cn

Office location: A8, qingchuangyuan, yuehua street, fangshan district, Beijing

Production base: B2 satellite navigation industrial park, Gu'an county, Langfang city, Hebei province

MUX400 High Vacuum Soldering Furnace

The MUX400 high vacuum soldering furnace is built for high-precision applications such as IGBT modules, MCMs, hybrid circuits, sensor packaging, and eutectic bump soldering. with customizable design options, it adapts to your specific needs, including varying sizes and heights. the furnace is equipped with a PID control system, high vacuum technology, and high heating rates, ensuring uniform soldering conditions. Its fully automated operation, alongside gas support systems and advanced control features, delivers an optimal soldering environment.

Key words:

Classification:

Product Consulting:

Equipment Capabilities Overview

The MUX400 high vacuum soldering furnace is primarily used in the following applications: IGBT modules, TR components, MCMs, hybrid circuit packaging, discrete component packaging, sensor/MEMS packaging (water-cooled), power device packaging, optoelectronic device packaging, hermetic sealing (water-cooled), and eutectic bump soldering.

Key Features

Uses japanese temperature control modules for PID regulation and both upper and lower heating systems, ensuring temperature control accuracy within ±1°C.
Option to upgrade with a high vacuum module, including the addition of a molecular pump system.
Supports multiple process gases, with precise flow control using Japanese MFC (Mass Flow Controller) technology.

Technical Performance

Main Technical Specifications	Specification Range
Basic Frame	1260mm * 1160mm * 1200mm
Chamber Height	80mm
Observation Window	Equipped with top observation window
Weight	Approx. 450Kg
Vacuum Pump	Mechanical oil pump or screw dry pump