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Tel: +86-10-80842121

Tel: +86-13273253358

E-mail:lydiama@horetech.cn

Office location: A8, qingchuangyuan, yuehua street, fangshan district, Beijing

Production base: B2 satellite navigation industrial park, Gu'an county, Langfang city, Hebei province

MUX200 High Vacuum Soldering Furnace

The MUX200 high vacuum soldering furnace offers a reliable solution for IGBT modules, TR components, MEMS, and optoelectronic device packaging. featuring advanced PID temperature control, high vacuum systems, and automated operation, it ensures consistent and precise soldering conditions. the system supports a wide range of gases and provides customizable tooling fixtures for stable soldering. Its efficient design and offline operation capabilities make it a dependable choice for high-performance soldering applications.

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Equipment Capabilities Overview

The MUX200 high vacuum reflow soldering furnace is primarily used in the following fields: IGBT modules, TR components, MCM (Multi-Chip Modules), hybrid circuit packaging, discrete component packaging, sensor/MEMS packaging (water-cooled), high-power device packaging, optoelectronic device packaging, hermetic sealing (water-cooled), and eutectic bump soldering.

Key Features

Precision temperature control: Utilizes japanese temperature control modules for PID regulation and both upper and lower heating, ensuring temperature accuracy within ±1°C.
Upgradeable with high vacuum module: Option to add a molecular pump system for enhanced vacuum capability.
Supports multiple process gases: Equipped with japanese MFC (mass flow controller) technology for precise gas flow control.

Technical Performance

Main Technical Specifications	Specification Range
Basic Frame	900mm * 820mm * 1000mm
Chamber Height	100mm
Observation Window	Equipped with top observation window
Weight	Approx. 280Kg
Vacuum Pump	Mechanical oil pump or screw dry pump