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MUX200
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MUX200 High Vacuum Soldering Furnace
The MUX200 high vacuum soldering furnace offers a reliable solution for IGBT modules, TR components, MEMS, and optoelectronic device packaging. featuring advanced PID temperature control, high vacuum systems, and automated operation, it ensures consistent and precise soldering conditions. the system supports a wide range of gases and provides customizable tooling fixtures for stable soldering. Its efficient design and offline operation capabilities make it a dependable choice for high-performance soldering applications.
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R&D team: 15 years of technological expertise in semiconductor packaging
Patent conversion: 20+ patents applied across 8 major Industries
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Domestic: Serving 300+ leading optoelectronics/new energy vehicle enterprises
International: Products covering 15 countries, Including Russia, Iran, India, and Pakistan
Trade: Global delivery system with CE/ISO certification
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