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Horetech Innovation and technology (Beijing) Co., Ltd.showcased its new products at the productronica China (Shanghai) exhibition, redefining semiconductor micro-packaging, which is truly worth looking forward to.

Release time:

2025-03-07

Horetech Innovation and Technology (Beijing) Co., Ltd. has always been committed to the research, development and production of cutting-edge packaging equipment products to meet market demands and drive the development of the industry. recently, after a long period of research, development and testing, the company is about to launch a series of new products. these new products have not only achieved major breakthroughs in technology, but also significantly improved the user experience.

In order to share this good news with industry colleagues and a large number of customers, and to showcase its latest research and development achievements, Horetech Innovation and Technology (Beijing) Co., Ltd. is about to participate in the productronica China (Shanghai) exhibition held from March 26th to 28th. this exhibition brings together electronic equipment manufacturers, suppliers and industry experts from all over the world, and it is an important platform for showcasing new technologies and products, as well as for exchanging industry trends.

Horetech Innovation and Technology (Beijing) Co., Ltd. is very honored to take this opportunity to showcase its newly developed products to domestic and foreign customers. these new products not only represent the company's latest achievements in the field of packaging equipment, but also reflect its unremitting pursuit of technological innovation and product quality.

Here, we sincerely invite you to visit the productronica China (Shanghai) exhibition and visit the booth of Beijing Horetech Technology Co., Ltd. - E5.5766. we look forward to having face-to-face communication with you and jointly exploring the future development trends of the semiconductor packaging equipment industry.