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Tel: +86-10-80842121

Tel: +86-13273253358

E-mail:lydiama@horetech.cn

Office location: A8, qingchuangyuan, yuehua street, fangshan district, Beijing

Production base: B2 satellite navigation industrial park, Gu'an county, Langfang city, Hebei province

M6100 Multifunctional Ball Bonder

The M6100 multifunctional ball bonder offers a comprehensive solution for wire bonding with precise control over bonding pressure, wire feed mechanism, and ultrasonic power. this machine supports multiple wire diameters and bonding knife types for diverse applications. with its adjustable worktable, high-precision control, and integrated microscope, the M6100 delivers exceptional performance for fine-wire bonding, ensuring superior results for electronic components in various industries.

Key words:

M6100

Classification:

Multi-functional Bonder

Product Consulting:

+86-10-80842121

lydiama@horetech.cn

Product inquiry

Equipment Introduction

The M6100 multifunctional ball bonder is a manual ball bonding equipment used for connecting the chip bonding pad to the bonding pad on the substrate or lead frame with gold wire, platinum wire, or copper wire. it is one of the essential key devices in the back-end packaging process on semiconductor production lines.

The M6100 bonder supports various bonding modes, including ball bonding, pressure bonding, wedge bonding, and ball placement. It features an XYZ-integrated operation handle and an electric braking system, providing flexibility and ease of operation. the unique ultrasonic control algorithm guarantees stable ultrasonic output and fast response time. the FPGA parallel control algorithm enables fast bonding speeds. the high-precision voice coil motor force control technology, combined with the force compensation algorithm, ensures precise bonding pressure control and superior bonding accuracy. the machine features an integrated and compact design that enhances the user experience.

Main Performance Indicators

Item	Specification
Maximum Cavity Depth	12mm
Bonding Pressure	1-250g, with 1g increments; program-controlled, adjustable interface
Braking System	Electric, no compressed air required
Liftable Workbench:	Adjustable height of 20mm
Workbench Dimensions	270mm×265mm

Application Fields

The M6100 multifunctional ball bonder is widely used in microwave devices, hybrid circuits, HF/RF devices, discrete devices, sensors, COB modules, MCM, MEMS devices, optoelectronic devices, etc.

Standard Configuration

Name	Model	Quantity
Main Equipment	M6100 (Ball Bonder)	1
Temperature Controller	220VAC 50/60Hz	1
Holding Platform	3″ with clips, non-slotted, 200℃	1
Microscope	15X magnification	1
Wire Spool	1/2″	1
Wire Clamp	90° wire feeding mechanism	1
Liftable Workbench	Travel 20mm	1
LED Ring Light	6W, brightness adjustable	1
Power Cord	D-type, 1.8m, 10A, 220VAC	1

Peripheral Parameters

Item	Specification
Input Voltage	220VAC±10%
Power	500W
Frequency	50Hz-60Hz
Dimensions	603mm(L)×596mm(W)×319mm(H)
Weight	46kg

Equipment Supply List

No.	Name	Product Model	Quantity
1	Ball Bonder Main Unit	M6100, Custom by Hanxian	1
2	Wire Clamp	90º Feed Mechanism, Custom by Hanxian	1
3	Liftable Table	Custom by Hanxian	1
4	Microscope	SZ51-60	1
5	Eyepiece	WHSZ15X-H	2
6	Heated Stage	3-inch heated stage, standard	1
7	Temperature Controller	Custom by Hanxian, with 200ºC standard	1
8	Ring Light	6W, brightness adjustable	1
9	Power Cord	D-type, 1.8m, 10A, 220VAC	1
10	Safety Ground Wire	Yellow-green, 2.5mm², 1m	1
11	ESD Ground Wire	Yellow-green, 2.5mm², 1m	1
12	Tweezers	VETUS 2-SA	1
13	Wrench	SATA 09119	1
14	Gold Wire	25μm, 90ft, 1/2″ spool	1
15	Blade (Ball Bonding)	16mm, UTS-33IG-AZM-1/16	1
16	Gold Substrate	MDFM2820	1
17	Ceramic Nozzle Socket	Custom by Hanxian	1
18	Needle	CUW-15	1
19	Torque Wrench	RTD30CN	1