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Tel: +86-10-80842121

Tel: +86-13273253358

E-mail:lydiama@horetech.cn

Office location: A8, qingchuangyuan, yuehua street, fangshan district, Beijing

Production base: B2 satellite navigation industrial park, Gu'an county, Langfang city, Hebei province

M6100 Multi-Function Ball Bonding Machine

The M6100 multi-functional ball-bonding bonder is a manual bonding system designed for electrical interconnection between chips and substrates as well as for inter-chip data communication. Based on the ultrasonic bonding principle, this equipment achieves tight bonding between bond wires and substrate pads through a precision mechanical structure and highly integrated hardware–software control. It supports ball-bonding with a variety of wire types, including gold wire, platinum wire, copper wire, and silver wire. The M6100 is widely used in semiconductor device R&D laboratories, prototype production runs, product evaluation, and product rework applications.

Key words:

M6100

Classification:

Multi-functional Bonder

Product Consulting:

+86-10-80842121

lydiama@horetech.cn

Product inquiry

Product Features

• The M6100 multi-functional ball-bonding bonder is a manual bonding system used for electrical interconnection between chips and substrates, as well as for inter-chip data communication.

• This equipment is based on the ultrasonic bonding principle and, through a precision mechanical structure and highly integrated hardware–software control, achieves a secure bond between the lead wire and the substrate pad.

• Ball bond bonding using a variety of wire types, including gold wire, platinum wire, copper wire, and silver wire;

• Widely applicable to laboratory R&D, pilot production of product prototypes, product evaluation, and product repair for semiconductor devices.

M6000 Integrated Ball-and-Wedge Multi-Function Bonding Machine

M6200 Multi-Function Wedge Bonding Machine

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