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Tel: +86-10-80842121

Tel: +86-13273253358

E-mail:lydiama@horetech.cn

Office location: A8, qingchuangyuan, yuehua street, fangshan district, Beijing

Production base: B2 satellite navigation industrial park, Gu'an county, Langfang city, Hebei province

M6000 Multifunctional Ball-Wedge Integrated Bonder

The M6000 multifunctional ball-wedge integrated bonder is a high-precision bonding solution suitable for various wire diameters and materials, including gold, platinum, copper, and aluminum. with customizable bonding knife types, ultrasonic power control, and an adjustable worktable, this machine ensures precise bonding for a wide range of applications. Featuring a 15X magnification microscope and a versatile hot stage, the M6000 guarantees top-tier performance for advanced bonding needs in electronics and microelectronics.

Key words:

M6000

Classification:

Multi-functional Bonder

Product Consulting:

+86-10-80842121

lydiama@horetech.cn

Product inquiry

Equipment Introduction

The M6000 multifunctional ball-wedge iIntegrated bonder is used for connecting the chip bonding pad to the bonding pad on the substrate or lead frame using platinum wire, gold wire/tape, aluminum wire, silver wire, or copper wire. it is a key piece of equipment in the back-end packaging process on semiconductor production lines.

The M6000 bonder supports both ball bonding and wedge bonding processes. it features an XYZ-integrated operation handle and an electric braking system, providing ease of operation and flexibility. the unique ultrasonic control algorithm guarantees stable ultrasonic frequency and rapid response time. the FPGA parallel control algorithm design enables fast bonding speed. the high-precision voice coil motor force control technology, combined with a force compensation algorithm, ensures accurate bonding pressure control and superior bonding precision. the machine features an integrated, compact design that enhances user experience.

Main Performance Indicators

Item	Specification
Maximum Cavity Depth	16mm
Bonding Pressure	1-250g, with 1g increments; program-controlled, adjustable interface
Wire Clamp Feed Stroke	800μm
Liftable Workbench	Adjustable height of 20mm
Workbench Dimensions	270mm×265mm

Application Fields

The M6000 multifunctional ball-wedge bonder is widely used in applications such as microwave devices, hybrid circuits, RF devices/modules, discrete components, sensors, COB modules, MCM, MEMS devices, and optoelectronic devices.

Standard Configuration

Name	Model	Quantity
Main Equipment	M6000 (Ball-Wedge Integrated Bonder)	1
Temperature Controller	220VAC 50/60Hz	1
Holding Platform	3″ with clips, non-slotted, 200℃	1
Microscope	15X magnification	1
Wire Spool	1/2″	1
Wire Clamp	90° wire feeding mechanism	1
Liftable Workbench	Travel 20mm	1
LED Ring Light	6W, brightness adjustable	1
Power Cord	D-type connector, 1.8m, 10A, 220VAC	1
Device Safety Ground Wire	Yellow-green, 2.5mm², 1m	1

Peripheral Parameters

Item	Specification
Input Voltage	220VAC±10%
Power	500W
Frequency	50Hz-60Hz
Dimensions	603mm(L)×596mm(W)×319mm(H)
Weight	46kg

Equipment Supply List

No.	Name	Product Model	Quantity
1	Ball-Wedge Integrated Bonder	M6000, Custom by Hanxian	1
2	Wire Clamp	90º Feed Mechanism, Custom by Hanxian	1
3	Liftable Table	Custom by Hanxian	1
4	Microscope	SZ51-60	1
5	Eyepiece	WHSZ15X-H	2
6	Heated Stage	3-inch heated stage, standard	1
7	Temperature Controller	Custom by Hanxian, 200ºC standard	1
8	Ring Light	6W, brightness adjustable	1
9	Power Cord	D-type, 1.8m, 10A, 220VAC	1
10	Safety Ground Wire	Yellow-green, 2.5mm², 1m	1
11	ESD Ground Wire	Yellow-green, 2.5mm², 1m	1
12	Tweezers	VETUS 2-SA	1
13	Wrench	SATA 09119	1
14	Gold Wire	25μm, 90ft, 1/2″ spool	1
15	Blade (Ball Bonding)	16mm, UTS-33IG-AZM-1/16	1
16	Blade (Wedge Bonding)	19mm, TKSVD-1/16	1
17	Gold Substrate	MDFM2820	1
18	Imperial Wrench	0.035″ specification	1
19	Ceramic Nozzle Socket	Custom by Hanxian	1
20	Needle	CUW-15	1
21	Torque Wrench	RTD30CN	1