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M6000 Integrated Ball-and-Wedge Multi-Function Bonding Machine

The M6000 Ball-and-Wedge Integrated Multi-Function Bonding Machine is a manual bonding device used for electrical interconnection between chips and substrates as well as for information exchange among chips. Based on the ultrasonic bonding principle, this equipment achieves tight bonding between bond wires and substrate pads through a precision mechanical structure and highly integrated hardware–software control. It offers both ball bonding and wedge bonding functions and can handle a wide range of bond wire types, including gold wire, platinum wire, copper wire, silver wire, aluminum wire, and gold ribbon. It is widely applicable to laboratory R&D, prototype production, product evaluation, and product rework in the semiconductor industry.

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M6100 Multi-Function Ball Bonding Machine

The M6100 multi-functional ball-bonding bonder is a manual bonding system designed for electrical interconnection between chips and substrates as well as for inter-chip data communication. Based on the ultrasonic bonding principle, this equipment achieves tight bonding between bond wires and substrate pads through a precision mechanical structure and highly integrated hardware–software control. It supports ball-bonding with a variety of wire types, including gold wire, platinum wire, copper wire, and silver wire. The M6100 is widely used in semiconductor device R&D laboratories, prototype production runs, product evaluation, and product rework applications.

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M6200 Multi-Function Wedge Bonding Machine

The M6200 multi-functional wire bonder is a manual wedge-bonding machine used to connect the bond pads on the die to the bond pads on the lead frame using platinum wire, gold wire or gold ribbon, aluminum wire, silver wire, or copper wire; it is one of the essential key pieces of equipment in the back-end packaging process on semiconductor production lines.

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