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V60 Helium/Nitrogen/Fluorinated Oil Leak Detection Platform

The helium–nitrogen–fluorinated-oil leak-testing platform is an automated leak-detection system specifically designed for both fine and coarse leak testing of electronic components such as semiconductor devices, integrated circuits, and electronic products. The system is equipped with a PLC (programmable logic controller) that enables fully automated control and operation of the entire leak-testing process, effectively preventing operator errors and enhancing testing efficiency. In addition, the nitrogen tank on the equipment is fitted with photoelectric level-sensing devices, allowing real-time monitoring of the oil level inside the tank.

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LDS4000 Helium Mass Spectrometer Leak Detector

Supports nitrogen purging to eliminate ambient helium interference and rapidly reduce background levels; the instrument’s superior performance enables 24/7 continuous online operation, with high-frequency testing as often as every few seconds. Equipped with a leak-check port and a fine particulate filter to remove even the tiniest contaminants, ensuring the instrument remains free from contamination and damage; features a dual-iridium-filament ion source and an optimized system design that effectively protects against atmospheric pressure surges; customizable leak-testing workstations are available for enhanced convenience.

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M6000 Integrated Ball-and-Wedge Multi-Function Bonding Machine

The M6000 Ball-and-Wedge Integrated Multi-Function Bonding Machine is a manual bonding device used for electrical interconnection between chips and substrates as well as for information exchange among chips. Based on the ultrasonic bonding principle, this equipment achieves tight bonding between bond wires and substrate pads through a precision mechanical structure and highly integrated hardware–software control. It offers both ball bonding and wedge bonding functions and can handle a wide range of bond wire types, including gold wire, platinum wire, copper wire, silver wire, aluminum wire, and gold ribbon. It is widely applicable to laboratory R&D, prototype production, product evaluation, and product rework in the semiconductor industry.

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M6100 Multi-Function Ball Bonding Machine

The M6100 multi-functional ball-bonding bonder is a manual bonding system designed for electrical interconnection between chips and substrates as well as for inter-chip data communication. Based on the ultrasonic bonding principle, this equipment achieves tight bonding between bond wires and substrate pads through a precision mechanical structure and highly integrated hardware–software control. It supports ball-bonding with a variety of wire types, including gold wire, platinum wire, copper wire, and silver wire. The M6100 is widely used in semiconductor device R&D laboratories, prototype production runs, product evaluation, and product rework applications.

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M6200 Multi-Function Wedge Bonding Machine

The M6200 multi-functional wire bonder is a manual wedge-bonding machine used to connect the bond pads on the die to the bond pads on the lead frame using platinum wire, gold wire or gold ribbon, aluminum wire, silver wire, or copper wire; it is one of the essential key pieces of equipment in the back-end packaging process on semiconductor production lines.

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Semi-Automatic Vacuum Parallel Sealing and Welding Machine PAL-V200A

The vacuum parallel sealing and welding machine is an automated, precisely aligned vacuum sealing and welding system. Operators manually place the tube shell and cover plate into their respective fixtures, select the corresponding process recipe, and initiate the program. The equipment then automatically picks up the cover plate, captures a visual image, and, following computational analysis, accurately positions the cover plate over the tube shell to achieve precise alignment. Subsequently, spot welding and seal welding are performed, followed by final sealing under high-vacuum conditions.

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Desktop Automatic Die Bonder DB300

The laser-vision-based micro-assembly die-bonding system effectively addresses users’ requirements for compact footprint and high-precision processing, featuring a modular design with flexible configuration and easy operation. Its core module integrates two key subsystems: a high-precision force-controlled placement system and a dispensing-and-fixing system. The system employs a micrometer-level gantry structure with single- or dual-drive configurations, enabling convenient integration and customization with other modules.

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