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MUX300 Thermally Activated High Vacuum Soldering Furnace

The MUX300 thermally activated high vacuum soldering furnace is designed for the precise activation and sealing of getter-based products, ideal for uncooled infrared detectors, MEMS, gyroscopes, and other high-precision applications. equipped with advanced temperature control, high vacuum systems, and customizable tooling fixtures, this furnace ensures uniform heating, rapid cooling, and reliable soldering in a stable vacuum environment. Its high-temperature capabilities and PID temperature control guarantee exceptional performance for sensitive components, making it the perfect choice for your soldering and activation needs.

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PAL-V200 Semi-Automatic Vacuum Parallel Sealing Machine

The PAL-V200 semi-automatic vacuum parallel sealing machine is designed for high and low vacuum sealing of ceramic substrates and metal lids. it features precise alignment, adjustable welding pressure, and a powerful vacuum system that ensures long-lasting, high-quality seals. the machine also offers an optional electrical activation module for products with getters. ideal for sealing in high/low vacuum environments, it guarantees precision and efficiency for both small and large components.

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PAL-A200 Automatic Parallel Sealing Machine

The PAL-A200 automatic parallel sealing machine is a high-precision semi-automatic machine designed for parallel sealing and welding. it automatically aligns and inspects cover plates, performing spot and seam welding for a range of components. with adjustable welding speed, pressure control, and precise Z-axis stroke, this machine ensures excellent sealing performance for a variety of sizes and materials. Ideal for electronic packaging, it combines automation with accuracy to enhance productivity and product quality.

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PAL-200 Semi-Automatic Parallel Sealing Machine

The PAL 200 automatic parallel sealing machine offers high-precision hermetic sealing and energy control for electronic packaging applications. it supports multiple welding modes and ensures consistent, reliable performance with adjustable pressure, voltage, and time controls. this machine is equipped with advanced systems for component handling, providing an optimal solution for high-performance sealing and welding tasks in the electronics industry. its versatile design supports a range of materials, including nickel-plated, gold-plated, and ceramics.

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V60 Helium and Nitrogen Fluorocarbon Oil Leak Detection Platform

The V60 helium and nitrogen fluorocarbon oil leak detection platform is designed for high-precision leak detection in various industrial applications. utilizing helium and nitrogen gas, this system offers accurate testing for fine and coarse leaks. with a vacuum level of ≤45Pa and adjustable pressure settings, it supports flexible operations with precise temperature and time control. Ideal for testing oil systems, this platform integrates PLC automation and a user-friendly touchscreen interface, ensuring efficient and reliable leak testing.

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LDS4000 Helium Mass Spectrometer Leak Detector

The LDS4000 helium mass spectrometer leak detector offers precision leak detection with a minimum detectable leak rate of 1×10^-13 Pa·m³/s. it features fast response times (≤0.2s) and a wide leak rate range (1×10^-3 to 1×10^-13 Pa·m³/s), making it suitable for a variety of testing applications. equipped with a yttrium oxide-coated iridium ion source and multiple output interfaces (RS232C and RS485), it provides efficient integration into testing systems. with a vacuum pump speed of 16m³/h and optional molecular pumps, the LDS4000 is ideal for accurate and quick leak identification in complex systems.

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M6000 Multifunctional Ball-Wedge Integrated Bonder

The M6000 multifunctional ball-wedge integrated bonder is a high-precision bonding solution suitable for various wire diameters and materials, including gold, platinum, copper, and aluminum. with customizable bonding knife types, ultrasonic power control, and an adjustable worktable, this machine ensures precise bonding for a wide range of applications. Featuring a 15X magnification microscope and a versatile hot stage, the M6000 guarantees top-tier performance for advanced bonding needs in electronics and microelectronics.

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M6100 Multifunctional Ball Bonder

The M6100 multifunctional ball bonder offers a comprehensive solution for wire bonding with precise control over bonding pressure, wire feed mechanism, and ultrasonic power. this machine supports multiple wire diameters and bonding knife types for diverse applications. with its adjustable worktable, high-precision control, and integrated microscope, the M6100 delivers exceptional performance for fine-wire bonding, ensuring superior results for electronic components in various industries.

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