孝感MUX200 Vacuum Eutectic Soldering Furnace

Soldering of germanium windows for uncooled infrared detectors, lasers, LED eutectic bonding, RF and microwave applications, and radar

Category:

孝感High Vacuum Furnaces

Product Description

1. Application areas:

Soldering of germanium windows for uncooled infrared detectors, lasers, LED eutectic bonding, RF and microwave applications, and radar

2. Equipment Features

*Suitable for low-volume application devices and laboratory R&D

*Temperature is regulated and controlled using PID, achieving optimal automatic thermal management.

*Supports multiple process gases, with all gas flows controlled by MFCs for precise flow regulation.

*All system components in the formic acid process are manufactured to stringent corrosion-resistant standards.

*Simple, easy-to-use software interface for effortless operation and real-time process analysis

3. Equipment Parameters

Project	Parameters
Equipment dimensions	900mm820mm1000mm
Cavity height	100mm
Observation window	Equipped with an observation window at the top.
Weight	Approximately 280 kg
Vacuum pump	Oil-sealed vacuum pump or dry vacuum pump
Process vacuum	5Pa
Process gas	Nitrogen gas, formic acid gas
Heating method	Infrared radiation heating, heating rate ≥ 120°C/min
Cooling method	Water-jacket cooling and N2, heating rate ≥120°C/min
Heating area	240mm*210mm
Temperature range	Room temperature to 450°C
Temperature control accuracy	±1℃
Hot plate uniformity	±2.5℃
Detection Channel	3 channels (multiple channels optional)
Power Requirements	380 V, 50 Hz, power ≤ 15 kW
Welding cycle time	10-25/min
Control Method	Siemens PLC + Industrial PC
Standard Configuration	Vacuum pump, chiller, gas system