南平M6100 Multi-Function Ball Bonding Machine

The M6100 multi-functional ball-bonding bonder is a manual bonding system designed for electrical interconnection between chips and substrates as well as for inter-chip data communication. Based on the ultrasonic bonding principle, this equipment achieves tight bonding between bond wires and substrate pads through a precision mechanical structure and highly integrated hardware–software control. It supports ball-bonding with a variety of wire types, including gold wire, platinum wire, copper wire, and silver wire. The M6100 is widely used in semiconductor device R&D laboratories, prototype production runs, product evaluation, and product rework applications.

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南平Multi-functional Bonder

86 400-673-6773

Product Description

Product Features

• The M6100 multi-functional ball-bonding bonder is a manual bonding system used for electrical interconnection between chips and substrates, as well as for inter-chip data communication.

• This equipment is based on the ultrasonic bonding principle and, through a precision mechanical structure and highly integrated hardware–software control, achieves a secure bond between the lead wire and the substrate pad.

• Ball bond bonding using a variety of wire types, including gold wire, platinum wire, copper wire, and silver wire;

• Widely applicable to laboratory R&D, pilot production of product prototypes, product evaluation, and product repair for semiconductor devices.

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