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平湖M6200 Multi-Function Wedge Bonding Machine
Category:
平湖Multi-functional Bonder
Product Description
Product Features
• The M6200 multi-functional bonding machine is used to bond the pads on the chip to the pads on the lead frame;
• A manual wedge-bonding equipment for bonding with platinum wire, gold wire/ribbon, aluminum wire, silver wire, or copper wire;
• It is one of the essential key pieces of equipment for the back-end packaging process on semiconductor production lines.
Application Fields of Multifunction Bonding Machines
Ten Years of Dedication, Multiple Patents
R&D team: 15 years of technological expertise in semiconductor packaging
Patent conversion: 20+ patents applied across 8 major Industries
Worldwide Service
Domestic: Serving 300+ leading optoelectronics/new energy vehicle enterprises
International: Products covering 15 countries, Including Russia, Iran, India, and Pakistan
Trade: Global delivery system with CE/ISO certification
HUATAO GROUP
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