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Integrated Sensing and Computing Chip CZ-CSC-001
Key words:
Classification:
Overview
The Integrated Sensing and Computing Chip CZ-CSC-001 adopts a multi-chip stacked design architecture, based on advanced technologies such as FPGA, high-performance MCU, wideband RF transceivers, and more for multi-core, multi-die collaborative design. It features multi-core collaborative architecture, programmability, multi-channel scalability, and low power consumption. It is mainly used in edge devices, unmanned systems, low-cost high-integration guidance heads, and individual soldier terminals in fields like industrial internet, public safety, and other intelligent equipment.
Chip Structure

Applications in Unmanned Systems

Typical Waveform
Modulation Scheme: OFDM/SCFDE + LDPC
Network: Supports networking applications with no more than 2 hops of relay
Transmission Rate: 6Mbps / 12Mbps
Bandwidth: 15MHz
Main Parameters
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RF Transceiver (2T2R) |
Transmission |
TX Maximum Output Power: ≥5dBm |
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TX EVM (Error Vector Magnitude): ≤3% |
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TX Spurious Suppression: ≥50dBc |
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TX Output Dynamic Range: ≥40dB |
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Reception |
Adjustable Channel Bandwidth: 20kHz ~ 60MHz |
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RX Gain Maximum Adjustment Range: 112dB |
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RX EVM: ≤3% |
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Noise Figure: ≤4dB |
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FPGA |
350k LE |
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CPU |
Quad-core 64-bit Cortex-A55, Maximum Clock Speed: 2.0GHz |
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NPU |
Supports 1Tops Computing Power |
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GPU |
Mali-G52 GPU |
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Supports OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1 |
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Embedded High-Performance 2D Acceleration Hardware |
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Multimedia processing |
Supports 4K 60fps H.265/H.264/VP9 Video Decoding |
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Supports 1080P 60fps H.265/H.264 Video Encoding |
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Supports 8M ISP, HDR |
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Interface |
LPDDR4, eMMC, GMAC, UART, SPI, I2C, USB 3.0, MIPI-CSI, MIPI-DSI, PCIe, eSATA 2.0 |
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