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Semiconductor packaging process

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4.9MB

Semiconductor laser packaging process and equipment

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1.2MB

Leak detection work instructions

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5.6MB

IGBT method of judgment

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2.8MB

High-reliability ceramic packaging solutions

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5.1MB

Butterfly packaging solutions for high-speed optoelectronics

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5.8MB

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Ten Years of Dedication, Multiple Patents

R&D team: 15 years of technological expertise in semiconductor packaging

Patent conversion: 20+ patents applied across 8 major Industries

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Domestic: Serving 300+ leading optoelectronics/new energy vehicle enterprises

International: Products covering 15 countries, Including Russia, Iran, India, and Pakistan

Trade: Global delivery system with CE/ISO certification

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