Focusing on semiconductor packaging and welding equipment

Horetech Innovation and Technology (Beijing) Co., Ltd.

We invite you to visit our booth and negotiate!

From March 20th to 22nd, we will meet at the Shanghai New International Expo Center (SNIEC).

Booth No.: T3307

PART/1 Company Introduction

Horetech Innovation and Technology (Beijing) Co., Ltd. focuses on the research and development, production and process services of semiconductor packaging and welding equipment. The company's production base is located in the satellite navigation industrial park in Gu'an County, Hebei Province. It is a 30-minute drive from Daxing Airport. It covers an area of 1900 square meters and has a 400-square-meter clean laboratory with a cleanliness level of 10,000. The company produces about 150 sets of vacuum furnace series products annually, about 100 sets of parallel seam welding series, and about 60 other supporting equipments. The module online vacuum furnace currently developed by the company is relying on the technical research and development team of the National University of Singapore, including the design team. The company's products are widely used in the optoelectronics industry, semiconductor industry, new energy vehicle industry, etc. At the same time, they are exported to the Russian, Middle East and Southeast Asian markets. There are agents in Chengdu, Shenzhen, Suzhou and Xi'an in China.

At the same time, the company has independently developed vacuum eutectic welding furnace, (getter) heat activated high vacuum welding furnace series, semi-automatic and fully automatic parallel sealing machine series, fully automatic desktop sticker, supporting equipment including laser vision cover opening machine, leak detection platform system, ultrasonic bonding machine, etc. At the same time, it has a complete micro-assembly ceramic packaging production line to provide deep processing business for the majority of households. High-quality products and efficient services escort your use.

PART/2 Main Products

Vacuum eutectic welding furnace MUX400

Low bubble rate and large area, special equipment for vacuum welding eutectic

Heating area: 420MMx320MM

Advanced PID + upper and lower radiant heating

One key automatic switch cavity control

Heat activated high vacuum welding furnace MUX300

The heat-activated high-vacuum welding furnace is suitable for welding windows with getters to bases and meets the requirements for thermal insulation welding under high temperature and high vacuum. It is often used for product devices such as infrared devices and gyroscopes that need to maintain high vacuum for a long time.

Semi-automatic parallel sealing machine PAL200

Ceramic metal tube shell and cover plate dedicated airtight sealing welding equipment

Dedicated to microwave, optoelectronics, MEMS, laser devices, etc

Shell size: (3x3) MM~ (200x200) MM

The fine leak detection rate is less than 5x10-9Pa · cm3/s (GJB548B)

Automatic alignment parallel sealing welding machine PAL-A200

The automatic alignment parallel sealing welder PAL-A200 is an automated device. Manual placement of the tube shell and cover plate in the corresponding fixtures respectively. Equipped with an automatic cover plate picking mechanism and a vision system, it can meet the demand for high-precision automatic cover plate alignment.

Laser vision cover opening machine JD-0200

Mainly used for the secondary unsealing of the cover plate of optoelectronic device packages with ceramic packaging and metal packaging. The device can be opened multiple times, and the base can be reused.

Desktop automatic bonding machine DB300

Its core module integrates two parts: a high-precision mounting system and a dispensing fixing system

The micron-level gantry single and double drive structure can be easily combined with other modules

Can be equipped with nozzle heating module, material tray/wafer placement plate, ultrasonic module, laser heating module, UV dispensing and curing module, thermal nitrogen and formic acid process protective gas module, substrate preheating module, process monitoring module, chip flip-chip welding module is widely used in the following fields:

(1) Electronic equipment: Micro LED, Mini LED display chips, metric 03015.008004 devices on next-generation mobile phones, large medical equipment (core imaging module assembly)

(2) Optical devices: laser LD palladium strip assembly, VCSEL, PD, LENS assembly, etc

(3) Semiconductors: MEMS devices, RF devices, microwave devices, and hybrid circuits

For more product details, please visit our booth!