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Tel: +86-10-80842121

Tel: +86-13273253358

E-mail:lydiama@horetech.cn

Office location: A8, qingchuangyuan, yuehua street, fangshan district, Beijing

Production base: B2 satellite navigation industrial park, Gu'an county, Langfang city, Hebei province

DB300 Full-Function Desktop Automatic Die Bonding Machine

The DB300 full-function desktop automatic solidification machine is a high-precision micro-assembly system, specifically designed for compact spaces and high-precision bonding processes. featuring a laser vision-based system and force-controlled mounting, this machine ensures accurate component placement with ±10μm placement accuracy and 3μm laser height detection. Ideal for applications such as MEMS, CCD/CMOS, and infrared detectors, it offers high throughput, reaching 180 components per hour. Its non-destructive soft landing system minimizes damage, making it a versatile and efficient solution for your bonding needs.

Key words:

Classification:

Desktop Automatic Die Bonding Machine

Product Consulting:

+86-10-80842121

lydiama@horetech.cn

Product inquiry

Overview

The full-function desktop automatic die bonding and placement system is a comprehensive laser vision-based micro-assembly solution for high-precision die bonding. It effectively addresses user demands for compact footprint and high-precision processes. with a modular design, flexible configuration, and easy operation, the core module integrates a high-precision force-controlled mounting system and a dispensing fixture system. the system uses a micron-level gantry structure with single and dual drives, allowing easy integration with other modules for various configurations.

This system is widely used in various fields, including electronic devices (micro LED, miniLED display chips, next-generation mobile devices with 03015 and 008004 components, large medical equipment (core imaging module assembly), optical devices (laser LD palladium bar assembly, VCSEL, PD, LENS, etc.), and semiconductors (MEMS devices, RF devices, microwave components, and hybrid circuits).

Key Features

Desktop high-precision multi-function placement and dispensing platform
AI flatness calibration system on the placement and dispensing platform, greatly reducing issues such as voids in die bonding.
Precision force-controlled soft landing system: Ensures minimal contact force, preventing damage to the chip or leaving marks on it, perfectly solving defects caused by traditional pneumatic control systems and improving throughput.

Main Specifications

Project	Content	Specification
External Dimensions	Weight	Approx. 120KG
External Dimensions	Dimensions	800mm × 700mm × 650mm (approx.)
Environmental Requirements	Input Power	220AC ± 5%, 50Hz, 10A
	Compressed Air (Nitrogen) Supply	0.2MPa ~ 0.8MPa
	Temperature Environment	25°C ± 5°C
	Humidity Environment	30% RH ~ 60% RH