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PAL-200 Semi-Automatic Parallel Sealing Machine

The PAL 200 automatic parallel sealing machine offers high-precision hermetic sealing and energy control for electronic packaging applications. it supports multiple welding modes and ensures consistent, reliable performance with adjustable pressure, voltage, and time controls. this machine is equipped with advanced systems for component handling, providing an optimal solution for high-performance sealing and welding tasks in the electronics industry. its versatile design supports a range of materials, including nickel-plated, gold-plated, and ceramics.

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Overview

Parallel sealing plays an important role in integrated circuit packaging, especially in high-reliability hermetic sealing. It is suitable for ceramic packaging and metal shell packaging that require strict control over moisture content and hermeticity. as a key piece of equipment, the parallel sealing machine is widely used in the packaging of optoelectronic devices, hybrid integrated circuits, BOX devices, and more. its technological advantages, such as high-precision vision positioning systems, hermetic sealing, thermal management performance, and automated production processes, are particularly significant.

 

Equipment Features

  1. Multiple welding modes: Circular welding, rectangular welding, regular polygonal welding, and array welding.
  2. Advanced sealing energy control solution: Significantly improves the welding quality of device edges and corners.
  3. Precise control of electrode wheel pressure.

 

PKG (Shell) Size Range (Minimum)

3mm × 3mm

PKG (Shell) Size Range (Maximum)

200mm × 200mm

PKG (Shell) Shape

Square, Round, Regular Polygon

Shell Material

Ceramic (Kovar with nickel plating, gold-plated solder ring), Kovar (nickel-plated, gold-plated), Stainless Steel


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