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The MUX400 high vacuum soldering furnace is built for high-precision applications such as IGBT modules, MCMs, hybrid circuits, sensor packaging, and eutectic bump soldering. with customizable design options, it adapts to your specific needs, including varying sizes and heights. the furnace is equipped with a PID control system, high vacuum technology, and high heating rates, ensuring uniform soldering conditions. Its fully automated operation, alongside gas support systems and advanced control features, delivers an optimal soldering environment.

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MUX200 High Vacuum Soldering Furnace

The MUX200 high vacuum soldering furnace offers a reliable solution for IGBT modules, TR components, MEMS, and optoelectronic device packaging. featuring advanced PID temperature control, high vacuum systems, and automated operation, it ensures consistent and precise soldering conditions. the system supports a wide range of gases and provides customizable tooling fixtures for stable soldering. Its efficient design and offline operation capabilities make it a dependable choice for high-performance soldering applications.

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MUX300 Thermally Activated High Vacuum Soldering Furnace

The MUX300 thermally activated high vacuum soldering furnace is designed for the precise activation and sealing of getter-based products, ideal for uncooled infrared detectors, MEMS, gyroscopes, and other high-precision applications. equipped with advanced temperature control, high vacuum systems, and customizable tooling fixtures, this furnace ensures uniform heating, rapid cooling, and reliable soldering in a stable vacuum environment. Its high-temperature capabilities and PID temperature control guarantee exceptional performance for sensitive components, making it the perfect choice for your soldering and activation needs.

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